High Thermal Conductivity Boron Nitride Ceramic HBN Components for Exceptional Temperature Resistance and Large Component Capability

Product Description

Hexagonal Boron Nitride (HBN) ceramics deliver exceptional thermal management and electrical insulation for demanding semiconductor manufacturing processes. With graphite-like structure but superior performance, our "white graphite" components maintain structural integrity in extreme temperatures while providing excellent heat dissipation - making them ideal for critical semiconductor equipment applications.

Key Technical Advantages & Performance Features

• Superior Thermal Management: High thermal conductivity ensures efficient heat dissipation in extreme processing environments

• Exceptional Temperature Resistance: Maintains structural integrity and performance stability at elevated temperatures exceeding 2000°C

• Large Component Capability: Advanced hot pressing technology enables production of large-dimension components up to 650mm diameter

• Enhanced Material Durability: Very low porosity structure provides superior chemical resistance against corrosive semiconductor processing environments

• Precision Manufacturing Ready: Mohs hardness of 2 allows easy machining into complex geometries with minimal post-processing

• Net Shape Production: Direct sintering capability reduces material waste and manufacturing costs

Primary Semiconductor Equipment Applications

Gas Distribution & Process Components

• Gas distribution plates & spray nozzles

• Top nozzles and baffle assemblies

• Pedestal heaters & cover plates

High-Temperature Processing Components

• RF windows & evaporation crucibles

• Wafer processing components & rings

• Heat resistant substrates & base materials

Why Choose Our Boron Nitride Ceramics?

Our HBN components are precision-engineered for reliability in the most demanding semiconductor fabrication environments. The unique combination of net-shape sintering capability, large diameter manufacturing (up to 650mm), and exceptional thermal properties makes them the optimal choice for:

• High-temperature thermal management systems

• Corrosive environment applications

• Precision semiconductor manufacturing

• Custom-shaped components requiring minimal post-processing

Search-Optimized Technical Highlights

• Boron nitride ceramics for semiconductor equipment

• HBN components with 650mm diameter capability

• White graphite for high-temperature applications

• Thermally conductive electrical insulators

• Corrosion-resistant semiconductor components

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High Thermal Conductivity Boron Nitride Ceramic HBN Components for Exceptional Temperature Resistance and Large Component Capability Images